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HPC 252010BMV-3R3M
Manufacturer Part Number
HPC 252010BMV-3R3M
Manufacturer
TAI-TECH Advanced Electronics Co., Ltd.
Detailed Description
3.3 UH SHIELDED DRUM CORE, WIREW
Package
1008
In Stock
964077 pcs
Data sheet
HPC-BMV-NV Series
Reference Price (In US Dollars)
Delivery Time
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Specifications
Product Attribute
Attribute Value
Type
Wirewound
Tolerance
±20%
Supplier Device Package
1008
Size / Dimension
0.098" L x 0.079" W (2.50mm x 2.00mm)
Shielding
Shielded
Series
-
Ratings
AEC-Q200
Q @ Freq
-
Package / Case
1008 (2520 Metric)
Package
Tape & Reel (TR)
Product Attribute
Attribute Value
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Material - Core
-
Inductance
3.3 µH
Height - Seated (Max)
0.039" (1.00mm)
Frequency - Self Resonant
-
Features
-
DC Resistance (DCR)
204mOhm Max
Current Rating (Amps)
1.7 A
Current - Saturation (Isat)
1.3A
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HPC 252010BMV-3R3M Datasheet PDF
Data sheet
Datasheet File Browse